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The Digital Integrated Circuit Chip is an advanced integrated circuitry solution designed for applications requiring pre-amplification. It integrates two channels of digital integrated circuitries within a 14-TSSOP mounting type, making it a perfect surface mount solution for a variety of applications. This chip is designed to be operated under a voltage supply of 3V to 3.6V.
The Digital Integrated Circuit Chip is designed to offer the highest quality pre-amplification performance, allowing it to be applied in many different applications. It also provides the highest reliability and stability compared to other solutions in the market. Its small form factor makes it ideal for space-constrained designs, and its excellent power efficiency enables it to be used in low-power applications.
The Digital Integrated Circuit Chip is an advanced solution for pre-amplification and other digital integrated circuit applications. It is uniquely designed to provide superior performance, reliability, stability, and power efficiency. It is an ideal choice for those seeking an integrated circuit solution for their applications.
Attribute | Description |
---|---|
Product | Digital Integrated Circuit Chip |
Number of Channels | 2 |
Interface | Serial |
Function | Line Driver |
Voltage - Supply | 3V ~ 3.6V |
Device Package | 14-TSSOP |
Applications | Pre-Amplifier |
Operating Temperature | -40°C ~ 85°C (TA) |
Mounting Type | Surface Mount |
Microchip's MCP6497T-E/SN Integrated Circuit Chip is an advanced circuit chip board with two channels and a 14-TSSOP device package. This chip is certified ROHS and made in the USA, and is perfect for a wide range of applications. It has a minimum order quantity of 10, and the price can be inquired. Packaging is Tape & Reel (TR). Delivery time is 5-10 working days, and payment terms are T/T. The supply ability is 1000pcs/day. The operating temperature range is -40°C ~ 85°C (TA). The chip's function is a line driver.
Integrated circuit chips should be packaged and shipped properly in order to ensure optimal performance and reliability. The following are recommended steps for packaging and shipping integrated circuit chips: